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There are five important features to consider when selecting the right quick-connect for your cooling systems:
1. Optimal flow rate with low pressure drop. One of the most crucial factors is maintaining optimum flow in the cooling system. System components with the lowest possible pressure drop reduce pump energy consumption, contributing to cost savings.
2. Extremely low spillage and air inclusion. It’s highly recommended to always choose quick-connects with the lowest spillage and air inclusion for clean coupling and uncoupling. Quick-connects with extremely low spillage prevent media spillage from causing damage or malfunction to adjacent equipment and mitigate the risk of unplanned downtime.
3. Compact design. Limited space in semiconductor cooling systems requires quick-connects to be compact in design and small in size.
4. Long term reliability. It’s a challenge to maintain the reliability of quick-connects left unused for long periods of time. Therefore, when selecting quick-connects, it’s crucial to work with a supplier that has extensive experience in quick connect solutions.
5. Compatible materials. Both the quick-connect body and sealing material must be compatible with the refrigerant to ensure long service life and leak-free operation.
As a professional supplier of fluid systems for the semiconductor industry, EGLOK provides a wide variety of quick-connects. EGLOK ensures the sealing and reliability of quick-connects through advanced design and manufacturing processes, as well as strict quality control. Suitable for a wide range of cooling systems and compatible with a variety of cooling media, EGLOK quick-connects are widely used in semiconductor, automotive manufacturing, energy storage power plants, information technology, and other fields.
QP series quick-connects are a star product among EGLOK cooling system solutions. Compatible with most fluids such as water glycol, heat transfer oil, cooling water, etc., these quick-connects are widely used in cooling systems in electronics, photovoltaic, information technology, and other industries.
Features
Technical Parameters
| Body Material | Stainless Steel or Aluminum Alloy | |
| Max. Working Pressure | 290 psig (20 bar) | |
| Working Temperature | FKM | -4°F to 392°F (-20°C to 200°C) |
| FFKM | -4°F to 527°F (-20°C to 275°C) | |
| NBR | -22°F to 212°F (-30°C to 100°C) | |
| EPDM | -40°F to 300°F (-40°C to 148°C) | |
| FVMQ | -40°F to 347°F (-40°C to 175°C) | |
| Flow Coefficient (Cv)① | QP8 | 0.9 |
| QP10 | 3.5 | |
| QP12 | 5.4 | |
① The above Cv values are for stem-to-body flow and may decline depending on specifications of fittings configured.
Spillage and Air Inclusion
| Series | Spillage cm3 | Air Inclusion cm3 |
| QP8 | ≤ 0.01 | ≤ 0.01 |
| QP10 | ≤ 0.01 | ≤ 0.02 |
| QP12 | ≤ 0.02 | ≤ 0.04 |
Compared with QP series quick-connects, the QTM series has a wider medium compatibility, making it a solution for ethylene glycol cooling systems.
Features
Technical Parameters
| Body Materials | 316 SS or Alloy 400 |
| Max. Working Pressure | 4500 psig (310 bar) |
| Working Temperature | 0°F to 212°F (-17°C to 100°C) |
Spillage and Air Inclusion
| Series | Spillage cm3 | Air Inclusion cm3 |
| QTM2 | 0.1 | 0.1 |
| QTM4 | 0.2 | 0.4 |
| QTM8 | 1.0 | 2.0 |
DESO only
In addition to the QP and QTM series star products, FITOK also provides QC, QF, QM, and QV series quick-connects for regular cooling pipelines, quick coupling and uncoupling, and other applications.
July 13, 2025
July 11, 2025
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July 13, 2025
July 11, 2025
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.